Technical documents
Specifications
Brand
VishayProduct Type
Polymer Capacitor
Technology
Polymer
Capacitance
10μF
Voltage
10 V
Mount Type
Surface Mount
Package/Case
3216-18
Tolerance
±20 %
Maximum Operating Temperature
105°C
Dimensions
3.2 x 1.6 x 1.6 mm
Length
3.2mm
Height
1.6mm
Depth
1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
€ 4.48
€ 0.448 Each (In a Pack of 10) (ex VAT)
10
€ 4.48
€ 0.448 Each (In a Pack of 10) (ex VAT)
Stock information temporarily unavailable.
10
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | € 0.448 | € 4.48 |
| 100 - 240 | € 0.33 | € 3.30 |
| 250 - 490 | € 0.33 | € 3.30 |
| 500 - 990 | € 0.307 | € 3.07 |
| 1000+ | € 0.283 | € 2.83 |
Technical documents
Specifications
Brand
VishayProduct Type
Polymer Capacitor
Technology
Polymer
Capacitance
10μF
Voltage
10 V
Mount Type
Surface Mount
Package/Case
3216-18
Tolerance
±20 %
Maximum Operating Temperature
105°C
Dimensions
3.2 x 1.6 x 1.6 mm
Length
3.2mm
Height
1.6mm
Depth
1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
