Technical documents
Specifications
Brand
Taiyo YudenCapacitance
22µF
Voltage
6.3V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
X5R
Tolerance
±20%
Dimensions
2 x 1.25 x 0.85mm
Length
2mm
Depth
1.25mm
Height
0.85mm
Series
M
Maximum Operating Temperature
+85°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Country of Origin
Japan
Product details
Taiyo Yuden Low Voltage M Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
P.O.A.
Each (In a Pack of 25) (ex VAT)
Standard
25
P.O.A.
Each (In a Pack of 25) (ex VAT)
Stock information temporarily unavailable.
Standard
25
Stock information temporarily unavailable.
Technical documents
Specifications
Brand
Taiyo YudenCapacitance
22µF
Voltage
6.3V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
X5R
Tolerance
±20%
Dimensions
2 x 1.25 x 0.85mm
Length
2mm
Depth
1.25mm
Height
0.85mm
Series
M
Maximum Operating Temperature
+85°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Country of Origin
Japan
Product details
Taiyo Yuden Low Voltage M Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
