Syfer Technology 100pF Multilayer Ceramic Capacitor MLCC, 5kV dc V, ±5% , SMD
Technical documents
Specifications
Brand
Syfer TechnologyCapacitance
100pF
Voltage
5kV dc
Package/Case
1808 (4520M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±5%
Dimensions
4.5 x 2 x 2mm
Length
4.5mm
Depth
2mm
Height
2mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 1808
FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1808 Range
€ 11.56
€ 2.313 Each (In a Pack of 5) (ex VAT)
5
€ 11.56
€ 2.313 Each (In a Pack of 5) (ex VAT)
5
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Technical documents
Specifications
Brand
Syfer TechnologyCapacitance
100pF
Voltage
5kV dc
Package/Case
1808 (4520M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±5%
Dimensions
4.5 x 2 x 2mm
Length
4.5mm
Depth
2mm
Height
2mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 1808
FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes