Technical documents
Specifications
Brand
RS ProAdhesive Type
Acrylic Adhesive
Application
Sealing
Material Compatibility
Metal, Plastic
Colour
Red
Product Form
Liquid
Package Type
Syringe
Package Size
10 ml
Cure Time
1 h
Viscosity Measurement
1450mPa/s
Special Features
Solvent Resistant
Maximum Operating Temperature
+140°C
Specific Gravity
1.16
Chemical Composition
Aliphatic Amines, Epoxy Resin, Neopentyl Glycol Diglycidyl Ether
Country of Origin
United Kingdom
Product details
RS Pro Heat Cured SMT Adhesive
Our RS Pro range of heat cured SMT Adhesive is a one part thixotropic paste adhesive that will provide a great bond for the protection of electronic components by either dipping or “glob topping. It packs a punch in great “green strength” or stickiness to ensure that the components do not move during handling. With the adhesive being supplied in a syringe, it makes for effortless mounting.
We recommend using a dispenser needle with this product. See below for compatible needles.
Features and benefits –
• High “green strength” (stickiness) for easy mounting.
• Resistant to PCB cleaning solvents to ensure components stay in place.
• Excellent electrical characteristics
• Long term stability after cure cycle
• Flexible in a cured state to ensure components are not stressed.
• Medium strength to allow for easy components removal for reworking.
• Thixotropic properties give a high dot profile.
• Working temperature after curing of -40°C to +130°C
• Non toxic
• 1% water absorption rate after 3 hours in boiling water so rest assure all moisture sensitive devices will be safe.
Looking for a dispenser needle?
General purpose dispenser – 669-3869
For a more precise dispenser needle – 505-7786
FAQ (Frequently Asked Questions)
Will this adhesive keep moisture away from my sensitive components?
Yes. This product is designed to be “glob topped” onto your PCB to protect your valuable components.
How fast will it cure?
This depends on the temperature you cure it at. The higher the temperature the faster it cures. We recommend the highest temperature you cure at is 120°C. At 120°C it will cure in 20 minutes.
RS PRO
RS PRO is our own brand range and brings you a wide range of high-quality, great value products offering you more choice. Trusted by engineers all over the world, every part of every RS PRO product has been rigorously tested against demanding industry standards; they’re only given the RS PRO Seal of Approval if we’re confident of their exceptional quality, which means you can be confident too.
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P.O.A.
1
Please note: Hazardous items will incur an additional delivery charge and have a much longer lead time. Please contact us for further details.
P.O.A.
1
Please note: Hazardous items will incur an additional delivery charge and have a much longer lead time. Please contact us for further details.
Technical documents
Specifications
Brand
RS ProAdhesive Type
Acrylic Adhesive
Application
Sealing
Material Compatibility
Metal, Plastic
Colour
Red
Product Form
Liquid
Package Type
Syringe
Package Size
10 ml
Cure Time
1 h
Viscosity Measurement
1450mPa/s
Special Features
Solvent Resistant
Maximum Operating Temperature
+140°C
Specific Gravity
1.16
Chemical Composition
Aliphatic Amines, Epoxy Resin, Neopentyl Glycol Diglycidyl Ether
Country of Origin
United Kingdom
Product details
RS Pro Heat Cured SMT Adhesive
Our RS Pro range of heat cured SMT Adhesive is a one part thixotropic paste adhesive that will provide a great bond for the protection of electronic components by either dipping or “glob topping. It packs a punch in great “green strength” or stickiness to ensure that the components do not move during handling. With the adhesive being supplied in a syringe, it makes for effortless mounting.
We recommend using a dispenser needle with this product. See below for compatible needles.
Features and benefits –
• High “green strength” (stickiness) for easy mounting.
• Resistant to PCB cleaning solvents to ensure components stay in place.
• Excellent electrical characteristics
• Long term stability after cure cycle
• Flexible in a cured state to ensure components are not stressed.
• Medium strength to allow for easy components removal for reworking.
• Thixotropic properties give a high dot profile.
• Working temperature after curing of -40°C to +130°C
• Non toxic
• 1% water absorption rate after 3 hours in boiling water so rest assure all moisture sensitive devices will be safe.
Looking for a dispenser needle?
General purpose dispenser – 669-3869
For a more precise dispenser needle – 505-7786
FAQ (Frequently Asked Questions)
Will this adhesive keep moisture away from my sensitive components?
Yes. This product is designed to be “glob topped” onto your PCB to protect your valuable components.
How fast will it cure?
This depends on the temperature you cure it at. The higher the temperature the faster it cures. We recommend the highest temperature you cure at is 120°C. At 120°C it will cure in 20 minutes.
RS PRO
RS PRO is our own brand range and brings you a wide range of high-quality, great value products offering you more choice. Trusted by engineers all over the world, every part of every RS PRO product has been rigorously tested against demanding industry standards; they’re only given the RS PRO Seal of Approval if we’re confident of their exceptional quality, which means you can be confident too.