AAT20, Single-Sided Photoresist Board Aluminium With 35μm Copper Thick, 200 x 300 x 1.5mm

RS Stock No.: 175-2780Brand: CIFManufacturers Part No.: AAT20
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Technical documents

Specifications

Brand

CIF

Base Material

Aluminium

Board Type

Photoresist Board

Number of Sides

1

Dimensions

200 x 300 x 1.5mm

Copper Thickness

35µm

FR Material Grade

Aluminium

Length

300mm

Thickness

200mm

Width

1.5mm

Country of Origin

France

Product details

Layered photosensitive boards, copper on aluminium

Pre-sensitised printed circuit boards for making power supply cards, SMT power transistor-based circuits, hybrid power circuits etc.
These boards are also used as Insulated Metal Substrate (IMS) in optoelectronics for the design of power LED circuits such as OSRAM's Golden Dragon and Luxeon Star.
Significant dissipation enables denser component layout.
Insulation fulfils three functions:
- adhesive between the copper and the aluminium
- dielectric insulation between the copper and the aluminium
- thermal relay between the active face of the circuit and the aluminium heat dissipating sole

Stock information temporarily unavailable.

€ 45.85

€ 45.85 Each (ex VAT)

AAT20, Single-Sided Photoresist Board Aluminium With 35μm Copper Thick, 200 x 300 x 1.5mm

€ 45.85

€ 45.85 Each (ex VAT)

AAT20, Single-Sided Photoresist Board Aluminium With 35μm Copper Thick, 200 x 300 x 1.5mm
Stock information temporarily unavailable.

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 4€ 45.85
5 - 9€ 43.33
10+€ 41.84

Technical documents

Specifications

Brand

CIF

Base Material

Aluminium

Board Type

Photoresist Board

Number of Sides

1

Dimensions

200 x 300 x 1.5mm

Copper Thickness

35µm

FR Material Grade

Aluminium

Length

300mm

Thickness

200mm

Width

1.5mm

Country of Origin

France

Product details

Layered photosensitive boards, copper on aluminium

Pre-sensitised printed circuit boards for making power supply cards, SMT power transistor-based circuits, hybrid power circuits etc.
These boards are also used as Insulated Metal Substrate (IMS) in optoelectronics for the design of power LED circuits such as OSRAM's Golden Dragon and Luxeon Star.
Significant dissipation enables denser component layout.
Insulation fulfils three functions:
- adhesive between the copper and the aluminium
- dielectric insulation between the copper and the aluminium
- thermal relay between the active face of the circuit and the aluminium heat dissipating sole