110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO

RS Stock No.: 922-6958Brand: EatonManufacturers Part No.: 262414 FAZ-XAM002IMPA: 0
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Technical documents

Specifications

Maximum Switching Power DC

0.90 W

Manufacturer Part No.

1SVR011700R0000 - CAIS E UNI 24V D

Output Voltage Adjustment Range

±22.8 V dc, ±25.2V dc

Compatible Pipe Size

4in

Brand

Eaton

Product details

Heat Sink 177AB Series, 300mm Wide x 83mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

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£ 47.90

Each (ex VAT)

110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO

£ 47.90

Each (ex VAT)

110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO
Stock information temporarily unavailable.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical documents

Specifications

Maximum Switching Power DC

0.90 W

Manufacturer Part No.

1SVR011700R0000 - CAIS E UNI 24V D

Output Voltage Adjustment Range

±22.8 V dc, ±25.2V dc

Compatible Pipe Size

4in

Brand

Eaton

Product details

Heat Sink 177AB Series, 300mm Wide x 83mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more