KEMET 3.3μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±20% , SMD

RS Stock No.: 769-6910Brand: KEMETManufacturers Part No.: C1812C335M5R2C7186
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Technical documents

Specifications

Brand

KEMET

Capacitance

3.3µF

Voltage

50V dc

Package/Case

1812 (4532M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±20%

Dimensions

5 x 3.5 x 5mm

Length

5mm

Depth

3.5mm

Height

5mm

Series

KPS

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Product details

Kemet KPS Stacked MLCC Series

Comercial grade single and 2-chip piled SMD multilayer ceramic capacitors
Use of a lead frame to mechanically isolate the capacitor from the board provides high reliability
Low ESR and ESL characteristics are ideal for high frequency switching power supplies
Other applications include: smoothing circuits or DC to DC convertors
Design allows for high levels of temperature cycling and board flex

2-Chip Piled Multilayer

Stock information temporarily unavailable.

€ 4.90

€ 4.90 Each (ex VAT)

KEMET 3.3μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±20% , SMD

€ 4.90

€ 4.90 Each (ex VAT)

KEMET 3.3μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±20% , SMD
Stock information temporarily unavailable.

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 9€ 4.90
10 - 24€ 4.68
25 - 49€ 4.44
50 - 99€ 4.20
100+€ 3.87

Technical documents

Specifications

Brand

KEMET

Capacitance

3.3µF

Voltage

50V dc

Package/Case

1812 (4532M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±20%

Dimensions

5 x 3.5 x 5mm

Length

5mm

Depth

3.5mm

Height

5mm

Series

KPS

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Product details

Kemet KPS Stacked MLCC Series

Comercial grade single and 2-chip piled SMD multilayer ceramic capacitors
Use of a lead frame to mechanically isolate the capacitor from the board provides high reliability
Low ESR and ESL characteristics are ideal for high frequency switching power supplies
Other applications include: smoothing circuits or DC to DC convertors
Design allows for high levels of temperature cycling and board flex

2-Chip Piled Multilayer